Telecentric vision system
High-precision dimensional inspection,
directly in production.
Every surface. Every part. 100% inspected.
65-megapixel matrix camera behind telecentric optics: image fields from 20 to 250 mm, resolution from approx. 3 µm, inspection time under one second per part. 100% inspection where your parts are manufactured — instead of downstream sampling.
Why telecentric, why inline
Measure precisely. Directly in the production cycle.
Checking tight tolerances today often means: removing parts, waiting for results, and continuing production without certainty. VISION.SPECTOR brings the measurement to where it belongs — to each individual part.
Conventional examination
- Subsequent testing: Parts leave the line, results are only available hours later.
- Sample instead of 100% — between two measurements the line continues production without feedback.
- Manual visual inspection is tiring, inconsistent, and can only be documented with considerable effort.
- Closed vision platforms: proprietary accessories, no access to image processing.
- Entocentric lenses distort at the image edge — dimensions become position-dependent.
With VISION.SPECTOR telecentric
- Telecentric optics measure without distortion across the entire image field — tolerances below 10 µm can be checked.
- Less than 1 second inspection time per part: 100% inspection at production speed, every result documented.
- Open architecture: IPC, Halcon and basic software are always included — you retain system control.
- Focus stacking also produces sharp images of tall components across their entire height.
- Variant switching via selection in the software — without mechanical modification.
USP · Focus-stacking
Sharp across the entire component height.
- 01The optics move along the linear axis in Z
- 02High-speed recordings at multiple focus planes
- 03Stacking combines all layers into one sharp image
- 04Halcon measures in a consistently sharp image
Scroll to control the flow
Application areas
Four industries, one modular system.
From over eight series projects, we know which testing tasks recur in which industry — and deliver the appropriate setup.
01
Medical technology
Injection molded and precision components with tight tolerances — 100% tested and documented.
- Dimensional accuracy of functional surfaces
- Burrs and defects on edges
- Completeness before packaging
02
Laser material processing
Measure cross-sectional and structural geometries directly after the process.
- Contour dimensions after laser cutting
- Bore and web widths
- Edge quality in the µm range
03
Automotive
Stamped, turned and plastic parts produced at the production rate of the line.
- Form and position inspection
- Thread and drill pattern inspection
- Presence of features
04
Electronics & Semiconductors
Large-field inspection of the finest structures — up to 250 mm image field at µm resolution.
- Wafer and substrate measurement
- Pad and conductor track geometry
- Assembly and position check
Plant variants
One base, several expansion stages.
Every system starts with the same foundation: telecentric inline inspection with workpiece carrier feeding. Additional modules extend it to include precisely the tests your component requires — without the need for special machine construction.
Variant 01
Inline telecentricity with 3D scan & lateral micrometer inspection
Telecentric dimensional inspection in top view, supplemented by a 3D scan and a micrometer inspection from the side — for features that a view alone cannot reliably capture.
- Height, flatness and coplanarity via 3D scan
- Diameter and lateral steps in the µm range
- One cycle, one test report per part
Variant 02
Inline telecentricity with structured light testing
Telecentric measurement combined with fringe light inspection: shape deviations and surface defects become visible before they lead to a complaint.
- Dents, sink marks and bulges in the stripe pattern
- Topography of large-scale functional areas
- Dimensional and surface inspection in the same cycle
Variant 03
Variant for miniaturized components
The telecentric test section of our series system for small bodies of revolution as an independent variant — for components in millimeter format with tolerances below the visual limit.
- Components with a diameter and height of less than 20 mm
- Small image fields — maximum resolution from approx. 3 µm
- Feeding via product carrier or tray
Variant 04
The open setup for laboratory and measuring room
The same telecentric measuring system in an open design: optics, lighting, and IPC on a stable platform — for initial sample inspection, measurement studies, and spot checks alongside the production line. Ideal as an entry point before 100% inspection moves into production.
- Initial sampling and feasibility studies using the same algorithms as inline
- Place part on the device, result in seconds — including test report
- Later, it can be transferred 1:1 into the production line: same setup, same software, same measured values
Configurator
Its component determines the system.
Set the image area, select options — resolution, setup, and price indication are calculated live. Your selection is automatically applied to the request.
Ring light
Ring light
ensures even illumination
Focus Stacking
Focus Stacking
The camera records multiple individual images while the focus plane is shifted
analysis
Further processing
While the sample is still being transported, the system is already analyzing the stacked images
Applications
One measuring system, four component worlds.
Telecentric 100% inspection of precision parts from four industries — using the same standard system, configured by field of view and resolution. Find your part.
Medical technology & pharmaceuticals.
Implants and abutments, cannulas, surgical instrument components, and dosing parts. Dimensional accuracy, diameters, and distances are checked with tolerances below 10 µm, as well as defects and anomalies—100% per part, in under one second, documented for regulated manufacturing.
Does my part fit?
Laser material processing.
Laser-cut, drilled, and precision-cut parts. Cutting contours, bore diameters, edge quality, burrs, and anomalies are inspected – telecentrically distortion-free, and thanks to focus stacking, consistently sharp even across material thickness and height offsets.
Does my part fit?
Automotive — Tier 1 & Tier 2.
Injection and valve components, sensor components, plug contacts, stamped and bent parts. Dimensional accuracy and completeness are checked in-line rather than by sampling in the measuring room — for high production volumes, with anomaly AI to detect unknown defect patterns.
Does my part fit?
Electronics & Semiconductors.
Substrates, panels, leadframes, and connectors. Dimensions, structures, and defects are inspected across large image fields up to 250 mm — with 65 megapixels in a single image instead of time-consuming scanning, proven in serial production projects in the semiconductor industry.
Does my part fit?
Software & Integration
Open architecture instead of a closed platform.
Not a closed system: Computers, image processing and software are standard — and remain accessible to you.
Complete system package
Industrial computers, professional image processing, and our basic software with user interface, results display, and data storage are included in every system. Variant changes are made directly within the software.
Application-specific image processing
Your testing task will be implemented individually — developed by our engineers, transparently calculated and accepted together with you on your parts.
Anomaly AI
AI-supported models detect deviations from the good sample — in addition to rule-based inspection. We will work with you to tailor the implementation and scope to your specific application.
Inquire now
Send us your component. We will test it.
Request a trial test now. With your own components and a subsequent professional test report.
What can I expect?
- Sensor configuration — find out which technologies are suitable for your application
- Cost estimate — find out early whether and when an automated inspection is worthwhile.
- Anonymized pilot data from a sample measurement at the Aachen technical center